The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Nov. 14, 1994
Yasuto Onitsuka, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An apparatus for bonding electronic components on a substrate with high precision and at high speed includes a table device for positioning the substrate to a bonding position, a transfer head that receives the electronic component, a rotating body with a plurality of transfer heads that rotates the transfer head to the bonding position, a recognition device that senses a deviation in position between the substrate and the electronic component which has been transferred by the transfer head to the bonding position and a driving mechanism which, according to the deviation in position sensed by the recognition device, finely displaces a lever installed on the transfer head in order to finely rotate the electronic component.