The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1998
Filed:
Sep. 26, 1996
Applicant:
Inventor:
Yasuto Onitsuka, Fukuoka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
22818022 ; 228-62 ; 228 447 ; 228 495 ;
Abstract
A bonding machine bonds electronic components to a substrate and makes it possible to prevent the breakage of wires from occurring without use of slip rings. A first terminal is connected to a thermal pressing head through a wire and is installed on a rotating member. A second terminal is connected to an electric power supply through a wire and is installed below the rotating member. The first terminal and second terminal contact only when electric current is supplied to the thermal pressing head. Both contacts are separated when the thermal pressing head releases the electronic component and is moved away from the substrate.