Company Filing History:
Years Active: 2004-2016
Introduction
Yasutaka Mizomoto is an accomplished inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor processing, reflected in his impressive portfolio of three patents. His innovative approaches enhance efficiency and precision in wafer processing.
Latest Patents
Mizomoto's latest patents include a "Device Wafer Processing Method" and a "Wafer Processing Machine." The device wafer processing method outlines an intricate procedure involving groove formation on a device wafer, followed by the attachment of a plate, grinding steps, and the subsequent dicing of a film along division lines. This method ultimately facilitates the division of the wafer into multiple chips.
On the other hand, the wafer processing machine features a robust design including a turntable, several chuck tables, and advanced polishing capabilities. The machine is equipped with a mounter for polishing tools and a flexible spindle unit that moves both perpendicular and parallel to the chuck tables, thereby ensuring an efficient and precise polishing process.
Career Highlights
Mizomoto is currently associated with Disco Corporation, a leading company in the semiconductor manufacturing sector. His work at Disco has positioned him as a vital player in the ongoing advancements in wafer processing technology. With his expertise, he continues to develop methods and equipment that advance the production and quality of semiconductor devices.
Collaborations
Throughout his career, Mizomoto has collaborated with notable individuals such as Ichiro Yamahata and Toshimitsu Goto. These collaborations have not only fostered innovative ideas but have also enhanced the technical capabilities and research efforts within the field.
Conclusion
Yasutaka Mizomoto's contributions to semiconductor processing are commendable and reflect his commitment to innovation. As he continues to develop new technologies at Disco Corporation, the impact of his work will likely be felt widely across the industry, driving forward the capabilities of wafer processing and semiconductor manufacturing.