Disco Corporation

Yasutaka Mizomoto

Takashi Mori

Satoshi Yamanaka

Ichiro Yamahata

Takashi Kouda

Toshimitsu Goto

Yoshisato Doi

Masanori Izumita

Katsunori Iizuka

Shinji Yasuda

A device wafer processing method includes, a groove forming step in which grooves with a predetermined depth are formed in the front side of a device wafer; a plate attaching step in which a plate is attached to the front side of the wafer through an adhesive; a grinding step in which the wafer is held by a holding table through the plate so as to expose the back side of the wafer, and the back side is ground to expose the grooves at the back side of the wafer, thereby dividing the wafer to form a plurality of chips. The method further includes: a film attaching step in which a film is attached to the back side of the wafer; and a dicing step in which the film is diced along division lines from the side of the back side of the wafer.

Device wafer processing method

A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

Wafer processing machine

A machining strain removal apparatus for removing machining strain present on a treated surface of a workpiece, for example, a ground back of a semiconductor wafer by polishing the treated surface or ground back with a polishing tool with a high efficiency in a high quality. The apparatus includes a chuck for holding the workpiece while exposing the treated surface, and a polishing component for polishing the treated surface of the workpiece held on the chuck. The polishing component includes a polishing tool, and presses the polishing tool being rotated against the treated surface of the workpiece, thereby polishing the treated surface.

Machining strain removal apparatus

Growing community of inventors

Tokyo, Japan

Yasutaka Mizomoto