The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Nov. 22, 2004
Yasutaka Mizomoto, Tokyo, JP;
Ichiro Yamahata, Tokyo, JP;
Toshimitsu Goto, Tokyo, JP;
Masanori Izumita, Tokyo, JP;
Katsunori Iizuka, Tokyo, JP;
Shinji Yasuda, Tokyo, JP;
Yasutaka Mizomoto, Tokyo, JP;
Ichiro Yamahata, Tokyo, JP;
Toshimitsu Goto, Tokyo, JP;
Masanori Izumita, Tokyo, JP;
Katsunori Iizuka, Tokyo, JP;
Shinji Yasuda, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.