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For the Inventor, By the Inventor

Osaka, Japan

Yasushi Inoue

This inventor holds 19 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Nitto-Denko Corporation, Hitachi Maxell, Limited. Active years: 1993-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasushi Inoue. Retrieved from https://idiyas.com/inventor/yasushi-inoue

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 89.5

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 172(Granted Patents)


Location History:

  • Osaka, JP (1993 - 2014)
  • Ibaraki, JP (2014)

Company Filing History:

goldMedal19 out of 3,953 
 
Nitto-Denko Corporation
 patents
silverMedal1 out of 1,112 
 
Hitachi Maxell, Limited
 patents
where one patent can have more than one assignee

Years Active: 1993-2014

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Areas of Expertise:
Light-Emitting Diode
Optical Semiconductor
Adhesive Composition
Circuit Board
Low Thermal Expansion
Multilayer Wiring
Wafer-Scale Package
Heat-Sensitive Recording
Magnetic Card
Manufacturing Method
19 patents (USPTO):Explore Patents
1. 8890190 - Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component (2014-11-18),
2. 8659157 - Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device (2014-02-25),
3. 8642362 - Method for producing light-emitting diode device (2014-02-04),
4. 8638001 - Adhesive sheet for producing semiconductor device (2014-01-28),
5. 6462282 - Circuit board for mounting bare chip (2002-10-08),
6. 6420018 - Low thermal expansion circuit board and multilayer wiring circuit board (2002-07-16),
7. 6373000 - Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board (2002-04-16),
8. 6335076 - Multi-layer wiring board and method for manufacturing the same (2002-01-01),
9. 6333469 - Wafer-scale package structure and circuit board attached thereto (2001-12-25),
10. 6328201 - Multilayer wiring substrate and method for producing the same (2001-12-11),
11. 6310391 - Mounted structure of circuit board and multi-layer circuit board therefor (2001-10-30),
12. 6258449 - Low-thermal expansion circuit board and multilayer circuit board (2001-07-10),
13. 6180261 - Low thermal expansion circuit board and multilayer wiring circuit board (2001-01-30),
14. 6159586 - Multilayer wiring substrate and method for producing the same (2000-12-12),
15. 5902768 - Reversible heat-sensitive recording material (1999-05-11),

Title: **Yasushi Inoue: Innovator in Semiconductor Technology**

Introduction

Yasushi Inoue is a prominent inventor located in Osaka, Japan, known for his significant contributions to semiconductor technology. With a total of 19 patents to his name, Inoue has made strides in improving the performance and efficiency of light-emitting diodes and semiconductor devices.

Latest Patents

Inoue's latest innovations include a patent for a light-emitting diode element that encapsulates an optical semiconductor layer with a resin layer containing a light reflection component. This invention aims to enhance the efficiency and effectiveness of light-emitting diodes. Additionally, he developed an adhesive composition for producing semiconductor devices that reduces ion scavenging deterioration, ensuring that the adhesive sheet maintains its properties even after thermal exposure.

Career Highlights

Throughout his career, Inoue has worked with notable companies, including Nitto Denko Corporation and Hitachi Maxell, Limited. His experience in these organizations has allowed him to excel in the field of semiconductor technology, leading to his numerous patented inventions.

Collaborations

Inoue has collaborated with esteemed colleagues such as Masakazu Sugimoto and Kei Nakamura, enhancing his innovative work in semiconductor technologies. Their combined efforts contribute to developing advanced solutions that address the evolving challenges in the tech industry.

Conclusion

Yasushi Inoue's extensive patent portfolio and collaborative spirit reflect his commitment to innovation in semiconductor technology. With ongoing contributions, he continues to pave the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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