The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Jun. 09, 1999
Applicant:
Inventors:
Megumu Nagasawa, Osaka, JP;
Masakazu Sugimoto, Osaka, JP;
Yasushi Inoue, Osaka, JP;
Kei Nakamura, Osaka, JP;
Assignee:
Nitto Denko Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ;
Abstract
A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.