The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Dec. 14, 2000
Applicant:
Inventors:
Kei Nakamura, Osaka, JP;
Masakazu Sugimoto, Osaka, JP;
Yasushi Inoue, Osaka, JP;
Megumu Nagasawa, Osaka, JP;
Takuji Okeyui, Osaka, JP;
Masayuki Kaneto, Osaka, JP;
Shinya Ota, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 2/372 ;
U.S. Cl.
CPC ...
H01R 2/372 ;
Abstract
A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer made of an organic high molecular weight resin and a circuit provided on each side of the insulating layer the circuits on both sides being electrically connected through via-holes filled with a conductor made of solder having a metal powder dispersed therein.