Kanagawa, Japan

Yasushi Ikeyama

This inventor holds 1 USPTO granted patent. Top assignee: Speedfam Co Ltd. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasushi Ikeyama. Retrieved from https://idiyas.com/inventor/yasushi-ikeyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Yasushi Ikeyama: Innovator in Polishing Pad Technology

Introduction

Yasushi Ikeyama is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of polishing technology, particularly through his innovative patent that enhances the efficiency of polishing pad control.

Latest Patents

Yasushi Ikeyama holds a patent for a "Polishing pad control method and apparatus." This invention features a single sensor that simultaneously measures the thickness and contour of a polishing pad before and after the polishing process. By determining the changes in thickness and contour caused by polishing, the system can output a reproduction signal for pad reproduction or a replacement signal for pad replacement. This technology enables efficient control of the surface accuracy of the polishing pad.

Career Highlights

Yasushi Ikeyama is currently employed at Speedfam Co Ltd, where he continues to develop and refine technologies related to polishing processes. His work has been instrumental in advancing the capabilities of polishing equipment, making it more effective and reliable.

Collaborations

Yasushi collaborates with Hatsuyuki Arai, contributing to the innovative environment at Speedfam Co Ltd. Their teamwork fosters the development of cutting-edge solutions in the polishing industry.

Conclusion

Yasushi Ikeyama's contributions to polishing pad technology exemplify the impact of innovation in manufacturing processes. His patent not only enhances the efficiency of polishing but also sets a standard for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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