Mito, Japan

Yasuo Akutsu



Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2004-2010

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5 patents (USPTO):Explore Patents

Title: Yasuo Akutsu: Innovator in Semiconductor Technology

Introduction

Yasuo Akutsu is a notable inventor based in Mito, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work has been instrumental in advancing electronic control units and semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor device that features a substrate with an electronic circuit. This device includes a semiconductor element connected to the electronic circuit through wire bonding. Additionally, it has a metallic core layer that is electrically connected to the semiconductor element, along with a plurality of conductive bumps on the opposite side of the substrate. A thermal hardenable resin seals the semiconductor element, and a metal plate is connected to the metal core layer. Another significant patent is a device for controlling a vehicle, which comprises a housing and a rectangular printed circuit board fixed inside the housing. This board contains a control circuit and plugs that facilitate signal transfer between the inside and outside of the housing.

Career Highlights

Yasuo Akutsu has worked with prominent companies such as Hitachi, Ltd. and Hitachi Car Engineering Co., Ltd. His experience in these organizations has allowed him to develop innovative solutions in the semiconductor industry.

Collaborations

Throughout his career, Yasuo has collaborated with talented individuals, including Kaoru Uchiyama and Masahiko Asano. These collaborations have contributed to the success of his projects and patents.

Conclusion

Yasuo Akutsu is a distinguished inventor whose work in semiconductor technology has led to multiple patents and advancements in electronic control systems. His contributions continue to influence the industry and inspire future innovations.

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