The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Dec. 08, 2006
Masahiko Asano, Mito, JP;
Yasuo Akutsu, Mito, JP;
Masahide Harada, Yokohama, JP;
Kaoru Uchiyama, Hitachiomiya, JP;
Shinichi Fujiwara, Kamakura, JP;
Isamu Yoshida, Fujisawa, JP;
Masahiko Asano, Mito, JP;
Yasuo Akutsu, Mito, JP;
Masahide Harada, Yokohama, JP;
Kaoru Uchiyama, Hitachiomiya, JP;
Shinichi Fujiwara, Kamakura, JP;
Isamu Yoshida, Fujisawa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.