Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Yasuo Akutsu

Kaoru Uchiyama

Masahiko Asano

Shuji Eguchi

Kunito Nakatsuru

Masahide Harada

Isamu Yoshida

Hiroatsu Tokuda

Tsuyoshi Fujita

Hirayoshi Tanei

Shinichi Fujiwara

Masato Kirigaya

Hiroshi Soma

A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Semiconductor device and electronic control unit using the same

A device for controlling a vehiclecomprising a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon, and plugsandprovided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of said housing; wherein the plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

Device for controlling a vehicle

A device for controlling a vehiclehas a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

A device for controlling a vehiclehaving a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon. Plugsandare provided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of the housing. The plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m /g to 3.0 m /g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of &plusmn;50&deg; C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.

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Mito, Japan

Yasuo Akutsu