Kameyama, Japan

Yasuji Kaneshima


Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 38(Granted Patents)


Location History:

  • Mie-ken, JP (2008 - 2012)
  • Kameyama, JP (2011 - 2015)

Company Filing History:


Years Active: 2008-2015

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10 patents (USPTO):Explore Patents

Title: Yasuji Kaneshima: Innovator in Semiconductor Mounting Techniques

Introduction

Yasuji Kaneshima is a prominent inventor based in Kameyama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative approaches have advanced the methods used in mounting semiconductor wafers, showcasing his expertise and dedication to the industry.

Latest Patents

Among his latest patents is a method of mounting a semiconductor wafer with a support board on a supporting adhesive tape joined to a ring frame. This invention involves cutting a resin sealing sheet into an adhesive sheet piece that is smaller than the wafer itself. The adhesive sheet piece is then joined to a supporting adhesive tape along with a ring frame. The adhesive tape, sandwiched between upper and lower housings, forms a chamber where the wafer with a support board is closely faced to the adhesive sheet piece. The chamber is divided into two spaces, and the differential pressure generated within these spaces causes the adhesive tape and adhesive sheet piece to cave and bend toward the wafer, effectively joining the adhesive sheet piece to the wafer.

Another notable patent is the work bonding and supporting method and apparatus that utilizes tape heating means. This method allows the adhesive tape for support to be heated and tensioned properly in both the tape width direction and the transport direction. A heated work is then bonded to the adhesive face of the tensioned adhesive tape, providing effective support for the work.

Career Highlights

Yasuji Kaneshima is currently employed at Nitto Denko Corporation, where he continues to innovate and develop new technologies in the semiconductor field. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor mounting processes.

Collaborations

Throughout his career, Kaneshima has collaborated with notable colleagues, including Masayuki Yamamoto and Naoki Ishii. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yasuji Kaneshima's contributions to semiconductor technology through his innovative patents and collaborative efforts have made a significant impact in the industry. His work continues to influence advancements in semiconductor mounting techniques, solidifying his reputation as a leading inventor in this field.

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