The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2011

Filed:

Nov. 09, 2007
Applicants:

Masayuki Yamamoto, Ibaraki, JP;

Yasuji Kaneshima, Kameyama, JP;

Inventors:

Masayuki Yamamoto, Ibaraki, JP;

Yasuji Kaneshima, Kameyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); H01B 13/00 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An outer edge of a protective tape projected from a semiconductor wafer is fixed and held by a tape holding section. In the condition, a part of the projected protective tape is caught and supported with a tape supporting section with a face having lower adhesive property provided in the outside of the traveling groove for the cutter. Furthermore, the part of the protective tape having the outer edge fixed and held with the tape holding section is compulsorily deformed and inserted into a depression provided between the tape holding section and the tape supporting section. Thereby, the part of the protective tape located in a traveling groove for the cutter is tensioned outward. A cutter blade is stuck into this tensioned part, and cuts the protective tape all over the peripheries of the wafer.


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