The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2011

Filed:

Nov. 09, 2007
Applicants:

Yasuji Kaneshima, Kameyama, JP;

Takashi Nishinohama, Kameyama, JP;

Masayuki Yamamoto, Ibaraki, JP;

Inventors:

Yasuji Kaneshima, Kameyama, JP;

Takashi Nishinohama, Kameyama, JP;

Masayuki Yamamoto, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cutter blade movably in a radial direction of a wafer is pressed for biasing to an outer circumferential edge of the semiconductor wafer. Simultaneously, the pushing biasing force of the cutter blade is controlled constant with automatic regulation corresponding to a traveling speed variation of the cutter blade, so that effect of a centrifugal force that works at the time of rotating travel of the cutter blade may not vary a pushing biasing force of the cutter blade. As a result, a contact pressure of the cutter blade to the outer circumferential edge of the semiconductor wafer is maintained stable.


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