Yang Wu

Title: Yang Wu: Inventor in Semiconductor Packaging

Introduction

Yang Wu is an inventor based in Chandler, Arizona, whose work includes innovations in microelectronic integrated circuit packaging. He is associated with Intel Corporation and is credited with 1 patent.

Latest Patents

Wu’s patent, “Package Architectures with Heterogeneous Integration of Various Device Thicknesses,” describes a microelectronic package structure in which two dies are coupled to a bridge structure at an interface. A thermally conductive mold material surrounds both dies on one side of the interface, while a second mold material surrounds the bridge structure on the opposing side. The architecture addresses the integration of devices with different thicknesses within a package.

Career Highlights

Wu’s listed patent work is associated with Intel Corporation and focuses on semiconductor packaging architecture. The patent describes an approach to arranging dies, a bridge structure, and mold materials within an integrated circuit package.

Collaborations

Wu’s listed coworkers include Gang Duan and Srinivas Pietambaram. Their names provide context for his professional connections, though the supplied information does not specify particular joint projects.

Conclusion

Yang Wu’s patent reflects work on heterogeneous integration in microelectronic packaging, combining dies of varying thicknesses with a bridge structure and surrounding mold materials.