Asan-si, South Korea

Yang-Hoon Ahn

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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2 patents (USPTO):Explore Patents

Title: Innovations in Semiconductor Packaging by Yang-Hoon Ahn

Introduction

Yang-Hoon Ahn is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to enhancing semiconductor technology.

Latest Patents

Ahn's latest patents include a novel design for semiconductor packages having a guide wall and related systems and methods. This patent describes a semiconductor package composed of a first package board, a first semiconductor chip situated on the board, a heat transfer layer positioned atop the chip, and a heat spreader covering the layer. Notably, the design includes a housing with a molding part that directly surrounds the chip and a guide wall that encircles the heat spreader, creating an efficient thermal management solution.

Another influential patent by Ahn details a semiconductor package apparatus that consists of two semiconductor packages, each equipped with their respective chips, substrates, terminals, and signal transfer mediums. This innovative apparatus employs package connecting solder balls that are supported by a guide member, facilitating improved assembly and reliability in semiconductor applications.

Career Highlights

Yang-Hoon Ahn is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics and semiconductor industry. His work has been instrumental in advancing the capabilities of semiconductor devices and their packaging solutions, catering to the ever-growing demands for efficient and compact electronic components.

Collaborations

Throughout his career, Ahn has collaborated with talented colleagues such as Dae-Young Choi and Jung-Do Lee. These partnerships have allowed for a dynamic exchange of ideas and have contributed to the successful development of innovative technologies in semiconductor packaging.

Conclusion

Yang-Hoon Ahn’s contributions to semiconductor packaging represent a significant leap forward in the field. His inventive patents not only enhance the functionality of semiconductor devices but also demonstrate the potential for future advancements in electronics. As he continues his work at Samsung Electronics, the industry can anticipate further innovations that will undoubtedly shape the future of semiconductor technology.

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