Samsung Electronics Co., Ltd.

Yang-Hoon Ahn

Dae-Young Choi

Donghan Kim

Tae-Hun Kim

Jung-Do Lee

Sun-Hye Lee

Tae-woo Kang

Jang-Woo Lee

A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.

Semiconductor packages having a guide wall and related systems and methods

A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.

Semiconductor package apparatus

Growing community of inventors

Asan-si, South Korea

Yang-Hoon Ahn