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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9343535 B1

PDFFull Text
Date of Patent:
May. 17, 2016

Filed:

Sep. 06, 2013

Semiconductor packages having a guide wall and related systems and methods

Applicants:

Jung-do Lee, Uiwang-Si, KR;

Tae-woo Kang, Suwon-si, KR;

Dong-han Kim, Osan-si, KR;

Jang-woo Lee, Cheonan-si, KR;

Inventors:

Jung-Do Lee, Uiwang-Si, KR;

Tae-Woo Kang, Suwon-si, KR;

Dong-Han Kim, Osan-si, KR;

Yang-Hoon Ahn, Asan-si, KR;

Jang-Woo Lee, Cheonan-si, KR;

Dae-Young Choi, Yeosu-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Myers Bigel & Sibley, PA

Primary Examiner:

Amar Movva

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 29/34 (2006.01); H01L 29/10 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 29/34 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 29/1033 (2013.01); H01L 23/3128 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.

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