The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Apr. 05, 2012
Tae-hun Kim, Cheonan-si, KR;
Dae-young Choi, Yeosu-si, KR;
Yang-hoon Ahn, Asan-si, KR;
Sun-hye Lee, Cheongju-si, KR;
Tae-hun Kim, Cheonan-si, KR;
Dae-young Choi, Yeosu-si, KR;
Yang-hoon Ahn, Asan-si, KR;
Sun-hye Lee, Cheongju-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Abstract
A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.