Company Filing History:
Years Active: 2012-2015
Title: The Innovative Contributions of Sun-Hye Lee
Introduction
Sun-Hye Lee is a prominent inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work primarily focuses on advancements in package-on-package technology, which is crucial for modern electronic devices.
Latest Patents
One of Sun-Hye Lee's latest patents is titled "Stacked packages having through hole vias." This invention provides a method for forming a package-on-package structure. The process involves creating an encapsulation that covers a wafer using a wafer-level molding technique. The wafer contains multiple semiconductor chips and through silicon vias (TSVs) that pass through these chips. The encapsulant is designed with openings that align with the TSVs. After the encapsulation and semiconductor chips are divided, they form several semiconductor packages. Subsequently, another semiconductor package is stacked on one of these packages, establishing an electrical connection through the TSVs.
Career Highlights
Sun-Hye Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves research and development in semiconductor packaging technologies, where he continues to innovate and improve existing methods.
Collaborations
Throughout his career, Sun-Hye Lee has collaborated with notable colleagues, including Tae-Hun Kim and Dae-Young Choi. These collaborations have contributed to the advancement of their projects and the overall success of their innovations.
Conclusion
Sun-Hye Lee's contributions to semiconductor technology exemplify the importance of innovation in the electronics industry. His patents and collaborative efforts continue to shape the future of electronic device manufacturing.