The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Feb. 15, 2011
Tae-hun Kim, Cheonan-si, KR;
Jin-woo Park, Seoul, KR;
Dae-young Choi, Yeosu-si, KR;
Mi-yeon Kim, Asan-si, KR;
Sun-hye Lee, Cheongju-si, KR;
Tae-Hun Kim, Cheonan-si, KR;
Jin-Woo Park, Seoul, KR;
Dae-Young Choi, Yeosu-si, KR;
Mi-Yeon Kim, Asan-si, KR;
Sun-Hye Lee, Cheongju-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.