This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2015-2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015-2016
Title: **Innovations by Yan-Yi Liao: A Pioneer in Semiconductor Packaging**
Introduction
Yan-Yi Liao, an accomplished inventor based in Taichung, Taiwan, has made significant strides in the field of semiconductor packaging. With a total of three patents to his name, Liao has contributed to innovative methods that enhance semiconductor integration and reliability, particularly through his work at Siliconware Precision Industries Co., Ltd.
Latest Patents
Liao's latest patents include groundbreaking fabrication methods for semiconductor packages. One notable invention involves a semiconductor package with embedded semiconductor elements. This design features a carrier with openings and conductive traces, enabling an efficient connection for multiple semiconductor elements. By embedding these elements, Liao's invention eliminates the need for an additional molding process, significantly reducing the risk of displacement during production.
Another crucial patent focuses on a fabrication method of a semiconductor package, which incorporates steps to mitigate internal stresses and warpage. By employing a pressure member and a redistribution layer (RDL) structure, this method enhances the durability and performance of semiconductor packages, ensuring better reliability in various applications.
Career Highlights
Working with Siliconware Precision Industries Co., Ltd., Yan-Yi Liao has established himself as a key figure in semiconductor research and development. His innovative approaches to semiconductor packaging have led to substantial advancements in manufacturing processes and product performance.
Collaborations
Liao collaborates closely with fellow inventors Yan-Heng Chen and Chun-Tang Lin, contributing to a dynamic team that is dedicated to driving innovation in the semiconductor industry. Their combined expertise enables them to tackle complex challenges and push the boundaries of current technologies.
Conclusion
Yan-Yi Liao's contributions to the field of semiconductor packaging exemplify the importance of innovation in advancing technology. With his ongoing work at Siliconware Precision Industries Co., Ltd. and his proven track record of patents, Liao is undoubtedly a vital player in the continued evolution of semiconductor technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile