Siliconware Precision Industries Co., Ltd.

Yan-Yi Liao

Chun-Tang Lin

Yan-Heng Chen

Chieh-Yuan Chi

Hsi-Chang Hsu

Hung-Wen Liu

Mu-Hsuan Chan

A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor element disposed on the first semiconductor element in the opening; and a redistribution layer structure formed on the carrier and the second semiconductor element for electrically connecting the conductive traces and the second semiconductor element. Since the semiconductor elements are embedded and therefore positioned in the opening of the carrier, the present invention eliminates the need to perform a molding process before forming the redistribution layer structure and prevents the semiconductor elements from displacement.

Fabrication method of semiconductor package having embedded semiconductor elements

A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a carrier; disposing at least a semiconductor element on the carrier; forming an encapsulant on the carrier and the semiconductor element for encapsulating the semiconductor element; removing the carrier; disposing a pressure member on the encapsulant; and forming an RDL structure on the semiconductor element and the encapsulant, thereby suppressing internal stresses through the pressure member so as to mitigate warpage on edges of the encapsulant.

Fabrication method of semiconductor package

Semiconductor package having embedded semiconductor elements

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Taichung, Taiwan

Yan-Yi Liao