Hefei, China

Yadong Ye

This inventor holds 1 USPTO granted patent. Top assignee: Changxin Memory Technologies, Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yadong Ye. Retrieved from https://idiyas.com/inventor/yadong-ye-smyyt4c5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Yadong Ye: Innovator in Chip Testing Technology

Introduction

Yadong Ye is a prominent inventor based in Hefei, China. He has made significant contributions to the field of chip testing technology. His innovative approach has led to the development of a unique method and apparatus for chip testing.

Latest Patents

Yadong Ye holds a patent for a "Chip test method and apparatus, computer device, and readable storage medium thereof." This patent outlines a method that includes applying a test signal to a to-be-tested chip. It also involves sending a data signal to the chip, allowing it to enter a test mode based on the signals received. Additionally, the method regulates the test voltage of the chip, enhancing its testing capabilities. He has 1 patent to his name.

Career Highlights

Yadong Ye is currently employed at Changxin Memory Technologies, Inc., where he continues to innovate in the field of semiconductor technology. His work focuses on improving the efficiency and reliability of chip testing processes.

Collaborations

Yadong collaborates with several professionals in his field, including his coworker Yinchuan Gu. Their combined expertise contributes to advancements in chip testing methodologies.

Conclusion

Yadong Ye's contributions to chip testing technology exemplify his commitment to innovation in the semiconductor industry. His patent and ongoing work at Changxin Memory Technologies, Inc. highlight his role as a key figure in this evolving field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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