Xingshou Pang

USPTO Granted Patents = 12 (Patent Applications = 3)

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 23(Granted Patents)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 2013-2023

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11784112 - Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package (2023-10-10),

2. 11417541 - Protection from metal migration on IC packages (2022-08-16),

3. 10515880 - Lead frame with bendable leads (2019-12-24),

4. 10446476 - Packaged integrated circuit having stacked die and method for therefor (2019-10-15),

5. 10217700 - Lead frame for integrated circuit device having J-leads and Gull Wing leads (2019-02-26),

6. 10181434 - Lead frame for integrated circuit device having J-leads and gull wing leads (2019-01-15),

7. 10037935 - Lead frame with dummy leads for burr mitigation during encapsulation (2018-07-31),

8. 9443746 - Floating mold tool for semicondcutor packaging (2016-09-13),

9. 9416002 - Packaged semiconductor sensor device with lid (2016-08-16),

10. 9324637 - Quad flat non-leaded semiconductor package with wettable flank (2016-04-26),

11. 8692387 - Stacked die semiconductor package (2014-04-08),

12. 8481369 - Method of making semiconductor package with improved standoff (2013-07-09),

Title: Xingshou Pang: Innovator in Integrated Circuit Technology

Introduction

Xingshou Pang is a prominent inventor based in Tianjin, China, known for his significant contributions to the field of integrated circuit technology. With a total of 12 patents to his name, he has made remarkable advancements that enhance the reliability and efficiency of integrated circuit packages.

Latest Patents

Among his latest patents, Xingshou Pang has developed an innovative integrated circuit package and a method to manufacture it, aimed at reducing bond wire defects. This process involves positioning an integrated circuit die on a die pad of a leadframe, connecting a bond wire between the die and a bond pad, and encapsulating these components with a specialized material to form a robust mold cap. Additionally, he has patented a method for protecting against metal migration on IC packages. This invention utilizes a mold chase with specially designed clamps that create gaps, allowing molding compound to extend along the leads, thereby minimizing the risk of undesirable conduction paths during testing.

Career Highlights

Xingshou Pang has had a distinguished career, working with leading companies in the semiconductor industry. He has been associated with NXP USA, Inc. and Freescale Semiconductor, Inc., where he has applied his expertise in integrated circuit design and manufacturing.

Collaborations

Throughout his career, Xingshou has collaborated with notable colleagues, including Jinzhong Yao and Zhigang Bai. Their combined efforts have contributed to advancements in semiconductor technology and innovation.

Conclusion

Xingshou Pang's work in integrated circuit technology exemplifies his commitment to innovation and excellence. His patents not only address critical challenges in the industry but also pave the way for future advancements in semiconductor design.

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3 patents pending:

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