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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Xingjian Cai

This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xingjian Cai. Retrieved from https://idiyas.com/inventor/xingjian-cai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7 

% Patents Active = 57.1

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Gilbert, AZ (US) (2008 - 2011)
  • Palo Alto, CA (US) (2018 - 2021)

Company Filing History:

goldMedal7 out of 56,394 
 
Intel Corporation
 patents

Years Active: 2008-2026

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7 patents (USPTO):Explore Patents
1. 12730490 - Power regulation circuit for droop mitigation in a power source voltage that powers a processing core (2026-09-08),
2. 10971444 - Voltage noise reduction of power delivery networks for integrated circuits (2021-04-06),
3. 9947619 - Coupling structures for signal communication and method of making same (2018-04-17),
4. 8044305 - Circuit board including hybrid via structures (2011-10-25),
5. 7564694 - Apparatus and method for impedance matching in a backplane signal channel (2009-07-21),
6. 7473137 - Right-angle coaxial connector (2009-01-06),
7. 7419404 - High speed signal backplane interface (2008-09-02),

Title: Innovations by Inventor Xingjian Cai

Introduction

Xingjian Cai is a prominent inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronics, particularly in power delivery networks and signal communication technologies. With a total of 7 patents to his name, Cai continues to push the boundaries of innovation.

Latest Patents

One of his latest patents focuses on voltage noise reduction of power delivery networks for integrated circuits. This invention describes an electronic apparatus and system that includes a first power delivery network (PDN) and a second PDN. The first PDN features a first inductor as part of its power rail, while the second PDN includes a second inductor. These inductors form a magnetically coupled inductor, which helps reduce voltage noise in the first PDN by providing migrated impedance.

Another notable patent by Cai involves coupling structures for signal communication and methods of making them. This invention outlines techniques for providing signal communication with vias extending in a substrate. In one embodiment, a first capacitor and a second capacitor are coupled in parallel between two vias, allowing for the concurrent communication of respective portions of a first signal. This innovation enhances the efficiency of signal transmission in electronic devices.

Career Highlights

Xingjian Cai is currently employed at Intel Corporation, where he applies his expertise in electronics to develop cutting-edge technologies. His work at Intel has positioned him as a key player in the advancement of electronic systems.

Collaborations

Cai has collaborated with notable colleagues, including Ke W Wang and Yun Ji. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Xingjian Cai's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as a leading inventor. His innovative solutions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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