Xing Wang

Title: Innovations of Inventor Xing Wang

Introduction

Xing Wang is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of integrated circuit packaging. His innovative work has led to the development of a unique patent that enhances the performance of electronic devices.

Latest Patents

Xing Wang holds a patent for a "Stiffener ring combined with ASIC power delivery." This invention includes an apparatus that features a printed circuit board (PCB) and an integrated circuit (IC) package connected to the PCB. The IC package consists of a package substrate, a die secured to the package substrate, and a stiffener ring that surrounds the die. The stiffener ring increases the rigidity of the package substrate while delivering electrical power to the integrated circuit. It includes a first conductive layer forming a power (PWR) plane and a second conductive layer forming a ground (GND) plane, with an insulating layer positioned between them.

Career Highlights

Xing Wang is currently employed at Cisco Technology, Inc., where he applies his expertise in electronic engineering and innovation. His work at Cisco has allowed him to contribute to cutting-edge technology in the networking and communications sector.

Collaborations

Throughout his career, Xing Wang has collaborated with talented professionals, including Xiaohong Wu and Mike Sapozhnikov. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Xing Wang's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patent for the stiffener ring combined with ASIC power delivery showcases his ability to enhance electronic device performance.