Cisco Technology, Inc.

Xing Wang

Joel Richard Goergen

Mike Sapozhnikov

Sayed Ashraf Mamun

Tomer Osi

Xiaohong Wu

An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

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Milpitas, CA, United States of America

Xing Wang