The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Oct. 04, 2021
Cisco Technology, Inc., San Jose, CA (US);
Xiaohong Wu, Santa Clara, CA (US);
Xing Wang, Milpitas, CA (US);
Mike Sapozhnikov, San Jose, CA (US);
Sayed Ashraf Mamun, San Jose, CA (US);
Tomer Osi, Rosh Ahayin, IL;
Joel Goergen, Soulsbyville, CA (US);
CISCO TECHNOLOGY, INC., San Jose, CA (US);
Abstract
An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.