Xiaohong Wu

Title: Innovations of Xiaohong Wu

Introduction

Xiaohong Wu is a notable inventor based in Santa Clara, CA (US). She has made significant contributions to the field of integrated circuit packaging. Her innovative work has led to the development of a unique apparatus that enhances the performance of electronic devices.

Latest Patents

Xiaohong Wu holds a patent for a "Stiffener ring combined with ASIC power delivery." This invention includes a printed circuit board (PCB) and an integrated circuit (IC) package connected with the PCB. The IC package features a package substrate, a die secured to the package substrate, and a stiffener ring that surrounds the die. The stiffener ring increases the rigidity of the package substrate while delivering electrical power to the integrated circuit. It consists of a first conductive layer forming a power (PWR) plane, a second conductive layer forming a ground (GND) plane, and an insulating layer positioned between the two conductive layers. Xiaohong Wu has 1 patent to her name.

Career Highlights

Xiaohong Wu is currently employed at Cisco Technology, Inc., where she continues to innovate and contribute to advancements in technology. Her work at Cisco has positioned her as a key player in the development of cutting-edge electronic solutions.

Collaborations

Xiaohong has collaborated with notable coworkers, including Xing Wang and Mike Sapozhnikov. These collaborations have further enhanced her innovative capabilities and contributed to the success of her projects.

Conclusion

Xiaohong Wu's contributions to the field of integrated circuit packaging exemplify her innovative spirit and dedication to technology. Her patent for the stiffener ring combined with ASIC power delivery showcases her ability to solve complex engineering challenges.