Cisco Technology, Inc.

Xiaohong Wu

Joel Richard Goergen

Mike Sapozhnikov

Sayed Ashraf Mamun

Tomer Osi

Xing Wang

An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Growing community of inventors

Santa Clara, CA, United States of America

Xiaohong Wu