Sayed Ashraf Mamun

Title: Innovations of Sayed Ashraf Mamun

Introduction

Sayed Ashraf Mamun is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work focuses on enhancing the performance and efficiency of electronic devices.

Latest Patents

One of his latest patents is titled "Stiffener ring combined with ASIC power delivery." This invention includes a printed circuit board (PCB) and an integrated circuit (IC) package connected with the PCB. The IC package features a package substrate, a die secured to the package substrate, and a stiffener ring that surrounds the die. This stiffener ring increases the rigidity of the package substrate while delivering electrical power to the integrated circuit. It consists of a first conductive layer forming a power (PWR) plane and a second conductive layer forming a ground (GND) plane, with an insulating layer in between.

Another significant patent is the "Integrated circuit package with heatsink." This apparatus includes an integrated circuit package and a heatsink. The integrated circuit package comprises a substrate, an integrated circuit, and two sets of signal conductors arranged along the peripheries of both surfaces of the substrate. The heatsink is strategically positioned along both surfaces to enhance thermal management.

Career Highlights

Sayed Ashraf Mamun is currently employed at Cisco Technology, Inc., where he continues to innovate in the field of electronics. His work has contributed to advancements in integrated circuit technology, making devices more efficient and reliable.

Collaborations

Throughout his career, Sayed has collaborated with talented individuals such as Mike Sapozhnikov and Tomer Osi. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Sayed Ashraf Mamun is a distinguished inventor whose work in integrated circuit packaging has led to multiple patents and significant advancements in electronic device performance. His contributions continue to shape the future of technology.