The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Sep. 02, 2021
Cisco Technology, Inc., San Jose, CA (US);
Mike Sapozhnikov, San Jose, CA (US);
Sayed Ashraf Mamun, San Jose, CA (US);
Tomer Osi, Rosh Ahayin, IL;
Amendra Koul, San Francisco, CA (US);
David Nozadze, San Jose, CA (US);
Upendranadh R. Kareti, Union City, CA (US);
Joel R. Goergen, Soulsbyville, CA (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.