Zhuhai, China

Xin Hua Zeng

This inventor holds 2 USPTO granted patents. Top assignee: Other. Active years: 2021-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xin Hua Zeng. Retrieved from https://idiyas.com/inventor/xin-hua-zeng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal2 out of 834,513 
Other
 patents

Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Xin Hua Zeng

Introduction

Xin Hua Zeng is a notable inventor based in Zhuhai, China. He has made significant contributions to the field of printed circuit board technology. With a total of 2 patents, his work showcases innovative approaches to enhancing electronic components.

Latest Patents

Zeng's latest patents include a resin flow restriction process and structure. This invention involves a printed circuit board that consists of a first and second core. The first core features a first conductive layer, a first non-conductive layer, a first copper layer, and a first opening. Additionally, it has a first solder mask connected to the first copper layer and a first FR4 laminate bonded to the first solder mask. The second core mirrors this structure with its own conductive and non-conductive layers, copper layers, and solder masks. A prepreg layer is strategically placed between the first and second copper layers, enhancing the board's functionality.

Another significant patent is the PCB with coin and dielectric layer. This design includes three conductive layers and two non-conductive layers. A dielectric layer is positioned between the second conductive layer and the second non-conductive layer, while a coin for heat dispersion is located beneath the dielectric layer. The printed circuit board also features a cavity for receiving a component, with plating within the cavity connecting the coin to the second conductive layer.

Career Highlights

Xin Hua Zeng has established himself as a key figure in the development of advanced printed circuit board technologies. His innovative designs have contributed to the efficiency and effectiveness of electronic devices.

Collaborations

Zeng has worked alongside talented colleagues, including Pui Yin Yu and Hong Zhang. Their collaborative efforts have furthered advancements in their field.

Conclusion

Xin Hua Zeng's contributions to printed circuit board technology reflect his innovative spirit and dedication to improving electronic components. His patents demonstrate a commitment to enhancing functionality and efficiency in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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