The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jul. 01, 2020
Multek Technologies Limited, Irvine, CA (US);
Other;
Abstract
A printed circuit board includes a first and second core. The first core has a first conductive layer, a first non-conductive layer, a first copper layer and a first opening. The first core also has a first solder mask connected to the first copper layer and a first FR4 laminate bonded to the first solder mask. The second core has a second conductive layer, a second non-conductive layer, a second copper layer and a second opening. The second core also has a second solder mask connected to the second copper layer and a second FR4 laminate bonded to the second solder mask. A prepreg layer is between the first copper layer and the second copper layer but not between the first FR4 laminate and the second FR4 laminate.