The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jul. 01, 2020
Multek Technologies Limited, Irvine, CA (US);
Pui Yin Yu, Hong Kong, CN;
Xin Hua Zeng, Zhuhai, CN;
Jian Ying Xue, Zhuhai, CN;
Hong Tu Zhang, Zhuhai, CN;
Other;
Abstract
A printed circuit board includes a first, second, and third conductive layer. The printed circuit boards also includes a first non-conductive layer between the first and second conductive layers and a second non-conductive layer between the second and third conductive layers. The printed circuit board further includes a dielectric layer between the second conductive layer and the second non-conductive layer and a coin for heat dispersion located underneath the dielectric layer. The printed circuit board also includes a cavity for receiving a component and a plating within the cavity to connect the coin with the second conductive layer. The plating extends less than 50 um above the second conductive layer.