Wuhan, China

Xianchun Deng

This inventor holds 1 USPTO granted patent. Top assignee: Yangtze Memory Technologies Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xianchun Deng. Retrieved from https://idiyas.com/inventor/xianchun-deng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Xianchun Deng: Innovator in Wafer Bow Control

Introduction

Xianchun Deng is a notable inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor technology, particularly in methods for controlling the bow of substrates.

Latest Patents

Xianchun Deng holds 1 patent for his invention titled "Methods and structures for changing wafer bow." This patent describes a method of controlling the bow of a substrate, which is crucial in semiconductor manufacturing. The method involves adjusting the bow of a substrate that has a dielectric layer formed on it. By performing an annealing process, the bow can be modified either upward or downward, depending on the process conditions applied.

Career Highlights

Xianchun Deng is currently employed at Yangtze Memory Technologies Co., Ltd., where he continues to innovate in the semiconductor industry. His work focuses on enhancing the performance and reliability of semiconductor devices through advanced substrate control techniques.

Collaborations

Some of his notable coworkers include JinHao Li and FeiFei Tu, who contribute to the collaborative efforts in research and development at their company.

Conclusion

Xianchun Deng's innovative work in wafer bow control exemplifies the importance of advancements in semiconductor technology. His contributions are vital for the ongoing evolution of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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