The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Jan. 03, 2022
Applicant:

Yangtze Memory Technologies Co., Ltd., Hubei, CN;

Inventors:

JinHao Li, Wuhan, CN;

FeiFei Tu, Wuhan, CN;

Xiao Hou, Wuhan, CN;

Xianchun Deng, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/477 (2006.01); H01L 21/3105 (2006.01); H01L 23/00 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 21/477 (2013.01); H01L 21/3105 (2013.01); H01L 23/562 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

According to an aspect of the disclosure, a method of controlling bow of a substrate is provided. In the method, a substrate is provided on which a dielectric layer is formed. The substrate has a bow with respect to a reference plane. The bow of the substrate is adjusted by performing an annealing process on the substrate. The annealing process includes one of a first process condition and a second process condition. The first process condition induces a tensile stress on the substrate to cause the substrate to bow upward with respect to the reference plane. The second process condition induces a compressive stress on the substrate to cause the substrate to bow downward with respect to the reference plane.


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Li, JinHao. (2024). Methods and structures for changing wafer bow (U.S. Patent No. 11955344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11955344

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