Xian Bin Wang

Title: Innovations of Xian Bin Wang

Introduction

Xian Bin Wang is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds three patents that showcase his innovative approaches in the field. His work primarily focuses on methods that enhance the fabrication processes of semiconductor devices.

Latest Patents

One of his latest patents is the "Method of fabrication of a die oxide ring." This invention introduces a new design and method for implementing an 'oxide ring' that surrounds a conventional die's guard ring or sealing ring. This design forms a mechanical stress release buffer between the sawing paths of the die and the active surface area of the semiconductor die. Another significant patent is the "Method to form shallow trench isolations." This method involves creating a pad oxide layer over a semiconductor substrate, followed by the deposition of a silicon nitride layer and a protective layer. The process includes etching the semiconductor substrate to form trenches for shallow trench isolations, ensuring that the silicon nitride layer remains intact during etching.

Career Highlights

Xian Bin Wang is currently employed at Chartered Semiconductor Manufacturing Ltd, where he applies his expertise in semiconductor fabrication. His innovative methods have contributed to advancements in integrated circuit manufacturing.

Collaborations

He has collaborated with notable coworkers, including Subramanian Balakumar and Kong Hean Lee, who share a commitment to advancing semiconductor technologies.

Conclusion

Xian Bin Wang's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to improving fabrication processes. His work continues to influence the industry and pave the way for future advancements.