The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Dec. 12, 2003
Fan Zhang, Singapore, SG;
Bei Chao Zhang, Singapore, SG;
Wuping Liu, Singapore, SG;
Kho Liep Chok, Singapore, SG;
Liang Choo Hsia, Singapore, SG;
Tae Jong Lee, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Xian Bin Wang, Singapore, SG;
Fan Zhang, Singapore, SG;
Bei Chao Zhang, Singapore, SG;
Wuping Liu, Singapore, SG;
Kho Liep Chok, Singapore, SG;
Liang Choo Hsia, Singapore, SG;
Tae Jong Lee, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Xian Bin Wang, Singapore, SG;
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Abstract
In accordance with the objectives of the invention a new design and method for the implementation thereof is provided in the form of an 'oxide ring'. A conventional die is provided with a guard ring or sealing ring, which surrounds and isolates the active surface area of an individual semiconductor die. The 'oxide ring' of the invention surrounds the guard ring or sealing ring and forms in this manner a mechanical stress release buffer between the sawing paths of the die and the active surface area of the singulated individual semiconductor die.