Xi-Hong Chen

Title: Xi-Hong Chen: Innovator in Semiconductor Technology

Introduction

Xi-Hong Chen is a prominent inventor based in Luzhu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to packaging solutions.

Latest Patents

One of his latest patents focuses on semiconductor packages. This invention includes a first substrate and a second substrate facing each other, with a plurality of first electrical connections positioned between them. The first material surrounds these connections, ensuring effective electrical coupling while maintaining structural integrity. Notably, the width of the first material varies, being smaller near the first substrate compared to the second substrate.

Another significant patent by Xi-Hong Chen involves methods and apparatus for package-on-package (PoP) structures. This invention outlines a process for forming a PoP structure by applying a first material to a set of electrical connections on a first substrate. The method ensures that electrical connections between the first and second substrates are established without the risk of electrical bridges or shorts during the reflow process.

Career Highlights

Xi-Hong Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.

Collaborations

Throughout his career, Xi-Hong Chen has collaborated with notable colleagues, including Meng-Tse Chen and Yi-Da Tsai. These partnerships have fostered a collaborative environment that enhances innovation and development in semiconductor technologies.

Conclusion

Xi-Hong Chen's contributions to semiconductor packaging and his innovative patents reflect his expertise and commitment to advancing technology in this critical field. His work continues to influence the future of electronic device manufacturing.