The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Sep. 05, 2012
Meng-tse Chen, Changzhi Township, TW;
Yi-da Tsai, Dongshi Township, TW;
Xi-hong Chen, Luzhu Township, TW;
Tao-hua Lee, Taipei, TW;
Wei-yu Chen, Taipei, TW;
Ming-da Cheng, Jhubei, TW;
Chung-shi Liu, Hsin-Chu, TW;
Meng-Tse Chen, Changzhi Township, TW;
Yi-Da Tsai, Dongshi Township, TW;
Xi-Hong Chen, Luzhu Township, TW;
Tao-Hua Lee, Taipei, TW;
Wei-Yu Chen, Taipei, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A package-on-package ('PoP') structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.