Company Filing History:
Years Active: 2014-2016
Title: Innovations of Tao-Hua Lee in Semiconductor Technology
Introduction
Tao-Hua Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of his latest patents involves semiconductor packages. This innovation includes a first substrate and a second substrate facing each other, with a plurality of first electrical connections positioned between them. The first material surrounds these connections, ensuring that the width of the material near the first substrate is smaller than that near the second substrate. This design aims to improve electrical coupling between the substrates.
Another notable patent by Lee is related to package-on-package (PoP) structures. This invention outlines a method for forming a PoP structure by establishing a first set of electrical connections on a first substrate. A first material is applied to these connections, followed by the introduction of a second substrate with its own set of electrical connections. The process includes a reflow step that ensures a reliable electrical connection while preventing shorts or bridges during the operation.
Career Highlights
Tao-Hua Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging, which is crucial for modern electronic devices.
Collaborations
Lee has collaborated with notable colleagues, including Meng-Tse Chen and Yi-Da Tsai. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.
Conclusion
Tao-Hua Lee's contributions to semiconductor technology through his patents reflect his commitment to innovation in the field. His work continues to influence the design and functionality of semiconductor packages, showcasing the importance of research and development in technology.