This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006-2007
Title: Winata Karta Tjandra: Innovator in CMP Technology
Introduction
Winata Karta Tjandra is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in chemical mechanical polishing (CMP) technology. With a total of 2 patents, Tjandra's work has advanced the efficiency and precision of wafer polishing processes.
Latest Patents
One of Tjandra's latest patents is the CMP apparatus and process sequence method. This innovative CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool that is strategically placed between adjacent polishing pads or belts. The apparatus allows for the successive polishing of a material layer on multiple wafers. The metrology tool measures the thickness of the material layer being polished on each wafer prior to the final polishing step. This ensures that the layer is polished to a desired target thickness, eliminating the need for an additional process cycle. The modular design of the metrology tool allows it to function seamlessly with the polishing pads or belts.
Career Highlights
Winata Karta Tjandra is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at TSMC has positioned him as a key player in the development of advanced manufacturing technologies. Tjandra's expertise in CMP technology has been instrumental in enhancing the quality and efficiency of semiconductor production.
Collaborations
Throughout his career, Tjandra has collaborated with esteemed colleagues such as Chen-Shien Chen and Yai-Yei Huang. These collaborations have fostered innovation and have contributed to the successful development of new technologies in the semiconductor field.
Conclusion
Winata Karta Tjandra's contributions to CMP technology exemplify his commitment to innovation in the semiconductor industry. His patents and collaborative efforts continue to influence the advancement of manufacturing processes, ensuring higher precision and efficiency in wafer polishing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile