The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Sep. 06, 2006
Chen-shien Chen, Hsin-Chu, TW;
Yai-yei Huang, Hsin-Chu, TW;
Ming-hsiang Kao, Tainan, TW;
Yih-shung Lin, Sanchung, TW;
Winata Karta Tjandra, Hsinchu, TW;
Chen-Shien Chen, Hsin-Chu, TW;
Yai-Yei Huang, Hsin-Chu, TW;
Ming-Hsiang Kao, Tainan, TW;
Yih-Shung Lin, Sanchung, TW;
Winata Karta Tjandra, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The metrology tool is used to measure the thickness of a material layer being polished on each of successive wafers in a lot prior to the final polishing step, in order to precisely polish the layer to a desired target thickness at the final polishing step. This renders unnecessary an additional process cycle to polish the layer on each wafer to the desired target thickness. The metrology tool may be modularized as a unit with the polishing pads or belts.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile