William R Scharrenberg

Title: Innovations by William R Scharrenberg

Introduction

William R Scharrenberg is a notable inventor based in Los Altos Hills, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of flip chip assemblies. With a total of 2 patents, his work has advanced the efficiency and reliability of electronic components.

Latest Patents

Scharrenberg's latest patents focus on the development of conductive epoxy flip-chip on chip assemblies. One of his inventions includes a flip chip on chip assembly that features a first flip chip and a second flip chip directly connected to the top of the first. This assembly utilizes electrically conductive epoxy to create an electrical connection between the two chips. Another embodiment of his invention involves a stack of semiconductor chips that are vertically interconnected, allowing for enhanced die density and reduced wire bonds, which ultimately improves reliability.

Career Highlights

William R Scharrenberg is currently associated with Cubic Memory, Inc., where he continues to innovate in the semiconductor space. His work has been pivotal in creating methods for forming flip chip assemblies that enhance the performance of electronic devices.

Collaborations

Some of his notable coworkers include Alfons Vindasius and Marc E Robinson, who have collaborated with him on various projects within the company.

Conclusion

William R Scharrenberg's contributions to the field of semiconductor technology through his innovative patents have significantly impacted the industry. His work continues to pave the way for advancements in electronic component design and functionality.