Cubic Memory, Inc.

William R Scharrenberg

Marc E Robinson

Alfons Vindasius

A flip chip on chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip and the second flip chip. In another preferred embodiment, the present invention provides a flip chip assembly including a plurality of semiconductor chips where the plurality of chips are vertically interconnected on top of one another to form an electrically interconnected stack of chips; a flip chip directly connected to the top chip of the stack of chips; and electrically conductive epoxy means disposed between said flip chip and said top chip to form an electrical connection between the flip chip and the top chip. In still another preferred embodiment, the present invention provides a flip chip assembly including a semiconductor wafer having a plurality of first flip-chips formed thereon; a plurality of second flip chips, each one of the second flip chips directly connected to a respective one of the plurality of first flip-chips; and electrically conductive epoxy means disposed between the respective first flip-chip and second flip-chip connections to form an electrical connection between the respective first flip-chip and second flip chip connections. The present invention provides several very desirable features, including the ability to: (1) bond one die to another die in a flip chip fashion; (2) the ability to add a third die on top of the two flip chip die arrangement and wire bond that combination of three dies with two sets of wire bonds; and (3) the ability to further enhance the improved flip chip arrangement by combining a flip chip process (DCP) with a vertical integration process (VIP) to allow for the stacking of a plurality of die (e.g., N die). The flip chip on chip process according to the present invention provides for higher die density in the same board area and a reduction in the number of wires bonds that are required (therefore enhancing the reliability).

Conductive epoxy flip-chip on chip

A flip chip on chip method for forming a flip chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip and the second flip chip. In another preferred embodiment, a method for forming a flip chip assembly including a plurality of semiconductor chips where the plurality of chips are vertically interconnected on top of one another to form an electrically interconnected stack of chips; a flip chip directly connected to the top chip of the stack of chips; and electrically conductive epoxy means disposed between said flip chip and said top chip to form an electrical connection between the flip chip and the top chip. In still another preferred embodiment, a method of forming a flip chip assembly including a semiconductor wafer having a plurality of first flip-chips formed thereon; a plurality of second flip chips, each one of the second flip chips directly connected to a respective one of the plurality of first flip-chips; and electrically conductive epoxy means disposed between the respective first flip-chip and second flip-chip connections to form an electrical connection between the respective first flip-chip and second flip chip connections.

Growing community of inventors

Los Altos Hills, CA, United States of America

William R Scharrenberg