Canton, MA, United States of America

William P Reynolds



Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2009-2020

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4 patents (USPTO):Explore Patents

**Title: Innovations by William P Reynolds in Electrostatic Clamping Technology**

Introduction

William P Reynolds is an accomplished inventor based in Canton, MA, known for his contributions to electrostatic clamping technologies. With a total of four patents to his name, Reynolds has made significant advancements in the field, particularly within the ion implantation systems used in semiconductor manufacturing.

Latest Patents

Among his notable inventions, Reynolds' latest patents include a method to provide consistent electrostatic clamping through real-time control of electrostatic charge deposition in an electrostatic chuck. This innovative technology features an electrostatic clamp designed to clamp a workpiece to a surface using electrodes, coupled with a power supply that can provide clamping voltage and frequency. Incorporating a data acquisition system allows for the measurement of current through the electrodes, helping to maintain the desired clamping force by varying clamping parameters based on real-time data.

Another key invention is the in-vacuum high-speed pre-chill and post-heat stations. This invention enhances the ion implantation process by providing a cooling system for workpieces in a vacuum environment. It comprises a pre-chill station that cools the workpiece before ion implantation, and a post-heat station that heats the workpiece after the process, ensuring optimal conditions for semiconductor fabrication.

Career Highlights

William P Reynolds currently works at Axcelis Technologies, Inc., a company renowned for its advanced semiconductor manufacturing equipment. Throughout his career, Reynolds has focused on improving processing techniques to enhance efficiency and performance in the industry.

Collaborations

Reynolds collaborates with esteemed colleagues such as William Davis Lee and William F DiVergilio, sharing insights and expertise to drive innovation in their field. Together, they contribute to advancements that push the boundaries of semiconductor technology.

Conclusion

William P Reynolds stands out as a prominent figure in the innovation of electrostatic clamping technologies. His patents reflect a deep understanding of the complexities of semiconductor manufacturing, showcasing his commitment to advancing technological capabilities. With continuous contributions to the industry, Reynolds remains a key inventor shaping the future of ion implantation systems.

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