Ladera Ranch, CA, United States of America

William M Gervasi

This inventor holds 8 USPTO granted patents. Top assignees: Netlist, Inc., S-Tec Corporation. Active years: 2007-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William M Gervasi. Retrieved from https://idiyas.com/inventor/william-m-gervasi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 87.5

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 674(Granted Patents)

Company Filing History:

Years Active: 2007-2015

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8971045 - Module having at least one thermally conductive layer between printed circuit boards (2015-03-03),

2. 8345427 - Module having at least two surfaces and at least one thermally conductive layer therebetween (2013-01-01),

3. 8065475 - Registered dual in-line memory module having an extended register feature set (2011-11-22),

4. 7839645 - Module having at least two surfaces and at least one thermally conductive layer therebetween (2010-11-23),

5. 7630202 - High density module having at least two substrates and at least one thermally conductive layer therebetween (2009-12-08),

6. 7375970 - High density memory module using stacked printed circuit boards (2008-05-20),

7. 7286436 - High-density memory module utilizing low-density memory components (2007-10-23),

8. 7254036 - High density memory module using stacked printed circuit boards (2007-08-07),

Title: The Innovative Contributions of William M. Gervasi

Introduction

William M. Gervasi is a notable inventor based in Ladera Ranch, California. He holds a total of eight patents, showcasing his significant contributions to the field of technology and engineering. His work primarily focuses on modules that enhance the performance and efficiency of electronic systems.

Latest Patents

Among his latest patents is a module featuring at least one thermally conductive layer between printed circuit boards. This innovative module is designed to be electrically connectable to a computer system. It includes an edge connector with multiple electrical contacts, at least one layer of thermally conductive material, and two printed circuit boards that are thermally coupled to the conductive layer. Another notable patent involves a module with at least two surfaces and a thermally conductive layer positioned between them. This design allows for improved thermal communication between circuit packages on both surfaces, enhancing the overall functionality of the module.

Career Highlights

William has worked with several prominent companies throughout his career, including Netlist, Inc. and S-Tec Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic module design.

Collaborations

William has collaborated with talented individuals in the industry, including Jayesh R. Bhakta and Robert S. Pauley, Jr. These collaborations have further enriched his work and led to the development of cutting-edge technologies.

Conclusion

William M. Gervasi's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative designs continue to influence the development of electronic systems, showcasing the importance of creativity and engineering in advancing technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]